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| ISO-9001 CERTIFIED BY DSCC M.S.KENNEDY CORP. FEATURES: ULTRA-ACCURATE/HIGH SLEW RATE INVERTING OPERATIONAL AMPLIFIER 739 (315) 701-6751 4707 Dey Road Liverpool, N.Y. 13088 Very Fast Setting Time - 10nS to 0.1% Typical Very Fast Slew Rate - 5500 V/S Typical Unity Gain Bandwidth - 220 MHz Typical Low Noise - 0.15uVrms Typical (f=0.1Hz to 10Hz) Very Accurate (Low Offset) 75V Max. Pin Compatable with AD9610 MIL-PRF-38534 QUALIFIED The MSK 739 is an inverting composite operational amplifier that combines extremely high bandwidth and slew rate with excellent D.C. accuracy to produce an amplifier perfectly suited for high performance data aquisition and conversion as well as high speed commmunication and line drive. The performance of the MSK 739 is guaranteed over the full military temperature range and for more cost sensitive applications is available in an industrial version. The standard package style is a space efficient 12 pin TO-8. However, alternate package styles are available upon request. DESCRIPTION: EQUIVALENT SCHEMATIC EQUIVALENT SCHEMATIC TYPICAL APPLICATIONS TYPICAL APPLICATIONS High Performance Data Aquisition Coaxial Line Driver Data Conversion Circuits High Speed Communications Ultra High Resolution Video Amplifier 1 2 3 4 5 6 1 PIN-OUT INFORMATION Positive Power Supply 7 Ground 8 NC NC 9 Negative Power Supply Case Ground 10 Negative Short Circuit Internal Feedback 11 Output Inverting Input 12 Positive Short Circuit Non-Inverting Input Rev. A 4/02 ABSOLUTE MAXIMUM RATINGS ELECTRICAL SPECIFICATIONS Parameter STATIC Supply Voltage Range 2 Quiescent Current Thermal Resistance 2 INPUT Input Offset Voltage Input Offset Voltage Drift Input Bias Current 7 Input Offset Current Input Impedance 2 Power Supply Rejection Ratio 2 Input Noise Voltage 2 2 2 Vcc=15V Unless Otherwise Specified Group A MSK 739B/E Typ. 15 35 36 45 25 0.5 10 15 5 5 5 1 0.15 3.8 0.6 12.5 10 22 220 5500 110 Max. 18 37 39 75 1.5 40 80 20 40 8 35 Min. 12 10 15 165 3500 95 MSK 739 Typ. 15 37 48 50 0.75 20 10 5 2 0.2 4 0.7 12.5 15 20 190 4000 105 Max. 18 40 100 60 30 20 45 Units V mA mA C/W V nA nA nA nA M V/V Vp-p nVHz pAHz V mA nS MHz MHz V/S dB Subgroup Min. Vin=0V 1 2,3 1 2,3 1 2,3 1 2,3 4 4 4 4 4 12 10 20 175 4000 100 Test Conditions Av=-1V/V Output Devices Junction to Case Vin=0V Av=-100V/V Vin=0V Vcm=0V Either Input Vcm=0V F=DC Differential Vcc=5V F= 0.1Hz To 10Hz F=1KHz F=1KHz RL=100 Av=-3V/V F10MHz TJ<150C 1 2 2.0 V/C Input Noise Voltage Density Input Noise Current Density OUTPUT Output Voltage Swing Output Current Settling Time Full Power Bandwidth Bandwidth (Small Signal) Slew Rate Open Loop Voltage Gain 2 2 100 120 100 120 0.1% 10V step RL=1K RL=100 Vo=10V RL=100 VOUT=10V RL=1K Av= -1.5V/V RL=1K F=1KHz VOUT=10V TRANSFER CHARACTERISTICS NOTES: 1 2 3 4 5 6 AV= -1, measured in false summing junction circuit. Guaranteed by design but not tested. Typical parameters are representative of actual device performance but are for reference only. Industrial grade and "E" suffix devices shall be tested to subgroups 1 and 4 unless otherwise specified. Military grade devices ("B" suffix) shall be 100% tested to subgroups 1,2,3 and 4. Subgroups 5 and 6 testing available upon request. TA=TC=+25C Subgroup 1,4 TA=TC=+125C Subgroup 2 TA=TC=-55C Subgroup 3 7 Measurement taken 0.5 seconds after application of power using automatic test equipment. 2 Rev. A 4/02 VCC IOUT VIN RTH Supply Voltage Peak Output Current Differential Input Voltage Thermal Resistance Junction to Case Output Devices Only +18V 200mA 12V 46C/W -65C to +150C TST Storage Temperature Range 300C TLD Lead Temperature Range (10 Seconds Soldering) See Curve PD Power Dissipation 150C TJ Junction Temperature TC Case Operating Temperature Range (MSK739B/E) -55C to+125C (MSK739) -25C to +85C APPLICATION NOTES HEAT SINKING To determine if a heat sink is necessary for your application and if so, what type, refer to the thermal model and governing equation below. The value of the short circuit current limit resistors (RSC) can be calculated as follows. +RSC=VCC-0.7/+ISC -RSC=VCC+0.7/-ISC Thermal Model: Short circuit current limit should be set at least 2X above the highest normal operating output current to keep the value of RSC low enough to ensure that the voltage dropped accross the short circuit current limit resistor doesn't adversely affect normal operation. INTERNAL FEEDBACK RESISTOR TJ=PD x (RJC + RCS + RJC) + TA Where TJ=Junction Temperature PD=Total Power Dissipation RJC=Junction to Case Thermal Resistance RCS=Case to Heat Sink Thermal Resistance RSA=Heat Sink to Ambient Thermal Resistance TC=Case Temperature TA=Ambient Temperature TS=Sink Temperature Governing Equation: The MSK 739 is equipped with an internal 1.5K feedback resistor. Bandwidth and slew rate can be optimized by connecting the MSK 739 as shown in Figure 2. Placing the feedback resistor inside the hybrid reduces printed circuit board trace length and its' asscociated capacitance which acts as a capacitive load to the opamp output. Reducing the capacitive load allows the output to slew faster and greater bandwidths will be realized. Refer to Table 1 for recommended RIN values for various gains. Example: This example demonstrates a worst case analysis for the op-amp output stage. This occurs when the output voltage is 1/2 the power supply voltage. Under this condition, maximum power transfer occurs and the output is under maximum stress. Conditions: VCC=16VDC VO=8Vp Sine Wave, Freq.=1KHz RL=100 For a worst case analysis we will treat the +8Vp sine wave as an 8VDC output voltage. 1.) Find Driver Power Dissapation PD=(VCC-VO) (VO/RL) =(16V-8V) (8V/100) =0.64W 2.) For conservative design, set TJ=+125C 3.) For this example, worst case TA=+90C 4.) RJC=45C/W from MSK 739B Data Sheet 5.) RCS=0.15C/W for most thermal greases 6.) Rearrange governing equation to solve for RSA RSA=((TJ-TA)/PD) - (RJC) - (RCS) =((125C -90C)/0.64W) - 45C/W - 0.15C/W =54.7 - 46.15 =9.5C/W TABLE 1 APPROXIMATE DESIRED GAIN -1 -2 -10 RIN VALUE 1.5K 750 150 Whenever the internal resistor is not being used it is good practice to short pin 4 and 5 to avoid inadvertently picking up spurious signals. Recommended External Component Selection Guide Using External Rf TABLE 2 APPROXIMATE DESIRED GAIN 1 1 1 1 1 1 -1 -2 -5 -8 -10 -20 RI(+) 249 160 169 100 90.9 100 RI(-) 499 249 200 124 100 100 Rf(Ext) 499 499 1K 1K 1K 2K Cf 2 2 2 2 2 2 The output section of the MSK 739 can be protected from direct shorts to ground by placing current limit resistors between pins 1 and 12 and pins 9 and 10 as shown in Figure 1. OUTPUT SHORT CIRCUIT PROTECTION 1 The positive input resistor is selected to minimize any bias current induced offset voltage. 2 The feedback capacitor will help compensate for stray input capacitance. The value of this capacitor can be dependent on individual applications. A 0.5 to 5pF capacitor is usually optimum for most applications. 3 Effective load is RL in parallel with Rf. 3 Rev. A 4/02 APPLICATION NOTES CON'T STABILITY AND LAYOUT CONSIDERATIONS As with all wideband devices, proper decoupling of the power lines is extremely important. The power supplies should be by-passed as near to pins 9 and 1 as possible with a parallel grouping of a 0.01f ceramic disc and a 4.7f tantalum capacitor. Wideband devices are also sensitive to printed cicuit board layout. Be sure to keep all runs as short as possible, especially those associated with the summing junction and power lines. Circuit traces should be surrounded by ground planes whenever possible to reduce unwanted resistance and inductance. The curve below shows the relationship between resonant frequency and capacitor value for 3 trace lengths. OPTIMIZING SLEW RATE When measuring the slew rate of the MSK 739, many external factors must be taken into consideration to achieve best results. The closed loop gain of the test fixture should be -1.5V/V or less with the external feedback resistor being 499 Lead length on this resistor must be as short as possible and the resistor should be small. No short circuit current limit resistors should be used. (Short pin 1 to pin 12 and pin 9 to pin 10). Pins 2,3,7 and 8 should all be shorted directly to ground for optimum response. Since the internal feedback resistor isn't being used, pin 4 should be shorted to pin 5. SMA connectors are recomended for the input and output connectors to keep external capacitances to a minimum. To compensate for input capacitance, a small 0.5 to 5pF high frequency variable capacitor should be connected in parallel with the feedback resistor. This capacitor will be adjusted to trim overshoot to a minimum. A 5500V/ S slew rate limit from -10V to +10V translates to a transition time of 2.9 nanoseconds. In order to obtain a transition time of that magnitude at the output of the test fixture, the transition time of the input must be much smaller. A rise time at the input of 500 picoseconds or less is sufficient. If the transition time of the input is greater than 500 picoseconds, the following formula should be used, since the input transition time is now affecting the measured system transition time. TA=TB+TC WHERE: TA=Transition time measured at output jack on MSK 739 test card. TB=Transition time measured at input jack on MSK 739 test card. TC=Actual output transition time of MSK 739(note that this quantity will be calculated, not measured directly with the oscilloscope). THE MSK 739 IS INVERTING, THEREFORE WHEN MEASURING RISING EDGE SLEW RATE: FEEDBACK CAPACITANCE Feedback capacitance is commonly used to compensate for the "input capacitance" effects of amplifiers. Overshoot and ringing, especially with capacitive loads, can be reduced or eliminated with the proper value of feedback capacitance. All capacitors have a self-resonant frequency. As capacitance increases, self-resonant frequency decreases (assuming all other factors remain the same). Longer lead lengths and PC traces are other factors that tend to decrease the self-resonant frequency. When a feedback capacitor's self-resonant frequency falls within the frequency band for which the amplifier under consideration has gain, oscillation occurs. These influences place a practical upper limit on the value of feedback capacitance that can be used. This value is typically 0.5 to 5pF for the MSK 739(B). TA=Rise time measured at output TB=Fall time measured at input TC=Actual rise time of output WHEN MEASURING FALLING EDGE SLEW RATE: TA=Fall time measured at output TB=Rise time measured at input TC=Actual fall time of output LOAD CONSIDERATIONS When determining the load an amplifier will see, the capacitive portion must be taken into consideration. For an amplifier that slews at 1000V/S, each pF will require 1mA of output current. To minimize ringing with highly capacitive loads, reduce the load time constant by adding shunt resistance. I=C(dV/dT) CASE CONNECTION The MSK 739(B) has pin 3 internally connected to the case. The case is not electrically connected to the internal circuit. Pin 3 should be tied to a ground plane for sheilding. For special applications, consult factory. 4 Rev. A 4/02 TYPICAL PERFORMANCE CURVES 5 Rev. A 4/02 MECHANICAL SPECIFICATIONS NOTE:Standard cover height: MSK 739 0.200 Max. Alternate lid heights available NOTE: ALL DIMENSIONS ARE 0.010 INCHES UNLESS OTHERWISE LABELED. ORDERING INFORMATION MSK739 B SCREENING BLANK=INDUSTRIAL; B=MIL-PRF-38534 CLASS H E=EXTENDED RELIABILITY GENERAL PART NUMBER 4707 Dey Road, Liverpool, New York 13088 Phone (315) 701-6751 FAX (315) 701-6752 www.mskennedy.com The information contained herein is believed to be accurate at the time of printing. MSK reserves the right to make changes to its products or specifications without notice, however, and assumes no liability for the use of its products. Please visit our website for the most recent revision of this datasheet. M.S. Kennedy Corp. 6 Rev. A 4/02 |
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